Title:
FLOOR MATERIAL
Document Type and Number:
Japanese Patent JPH05153714
Kind Code:
A
Abstract:
PURPOSE: To facilitate installation work of electric components at site by arranging the electric components without requiring cutting of floor material.
CONSTITUTION: Wiring grooves 2 are made in the surface of a floor material 1 to be laid on the floor surface. A cover 3 is applied on the upper opening of the recess 2 so that the upper opening is closed. An electric component having substantially identical planar profile to the cover plate 3 is installed in place of a part of the cover plate 3.
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Inventors:
MORI KEIJI
Application Number:
JP30954491A
Publication Date:
June 18, 1993
Filing Date:
November 26, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
E04F15/024; E04F15/18; H02G3/38; (IPC1-7): E04F15/024; E04F15/18; H02G3/28
Attorney, Agent or Firm:
Ishida Chochichi (2 outside)