Title:
FLOOR STRUCTURE
Document Type and Number:
Japanese Patent JP2007197921
Kind Code:
A
Abstract:
To provide a floor structure with high heat insulating performance by eliminating heat insulation loss among strut materials in a lower section of a partition wall, that of a sill and that of an edge floor joist.
In this floor structure 1, a sub-floor material 4, which is composed of a thermoplastic foamed resin, is spread in a close contact state all over the top surface of a slab 3, and a finishing plate 7 is spread all over the top surface of the sub-floor material 4, so that a double floor can be formed. The edge joist 9, partition wall 2 or sill 20 of the double floor is installed on the top surface of the slab 3 via heat insulating boards 12, 18 and 21.
COPYRIGHT: (C)2007,JPO&INPIT
Inventors:
TSUGANEZAWA SATORU
MIYAMOTO NOBUYUKI
MIYAMOTO NOBUYUKI
Application Number:
JP2006014983A
Publication Date:
August 09, 2007
Filing Date:
January 24, 2006
Export Citation:
Assignee:
YUKA SANSHO KENZAI KK
International Classes:
E04F15/00; E04F15/18
Attorney, Agent or Firm:
Isao Sasaki
Kyoko Kawamura
Kyoko Kawamura
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