Title:
Flow sensor manufacturing method
Document Type and Number:
Japanese Patent JP6361523
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a flow rate sensor with which it is possible to suppress the occurrence of the inflection or change of the characteristics of a sensor chip while reducing a gap between the reverse side and the groove part of the sensor chip.SOLUTION: A sensor support 20 has one face 25 and a groove part 26 in which a portion of the one face 25 is recessed. A sensor chip 40 is configured so as to be placed in the groove part 26 of the sensor support 20 and to detect the flow rate of a fluid flowing upward of a sensing part 43. Furthermore, a portion of the reverse side 44 of the sensor chip 40, which is different from a portion thereof that corresponds to the sensing part 43, is fixed to the bottom face 27 of the groove part 26 via an adhesive 60. The groove part 26 of the sensor support 20 is joined to the bottom face 27 and provided on the same plane as the bottom face 27, and further has a jig-touching area 27a to which a portion of a jig 80 for assembling the sensor chip 40 to the groove part 26 is made to contact.
Inventors:
Yusuke Ichikawa
Takuya Sato
Takuma Kono
Takuya Sato
Takuma Kono
Application Number:
JP2015025201A
Publication Date:
July 25, 2018
Filing Date:
February 12, 2015
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01F1/684; G01F1/692; H01L21/52
Domestic Patent References:
JP2001091322A | ||||
JP2013197146A | ||||
JP5109791A | ||||
JP7326636A | ||||
JP57148847U | ||||
JP7086314A | ||||
JP2004179256A | ||||
JP2013040917A | ||||
JP2001508879A |
Foreign References:
US20120001273 |
Attorney, Agent or Firm:
Patent Business Corporation Kaisei Patent Office
Previous Patent: A tape printer provided with a ribbon sending device and this
Next Patent: JPS6361524
Next Patent: JPS6361524