Title:
流体噴射装置
Document Type and Number:
Japanese Patent JP4538249
Kind Code:
B2
Abstract:
In one embodiment, the present invention recites a fluid ejection device comprising a first drop ejector (303 and 406) associated with a firing chamber (301). The first drop ejector is configured to cause fluid having a first drop weight to be ejected from the firing chamber, wherein the first drop ejector includes a first heating element (303) and first drive circuitry (406) electrically coupled with the first heating element. The present embodiment further comprises a first bore (317) disposed within an orifice layer (305) disposed proximate the first drop ejector and associated with the first drop ejector. The present embodiment also comprises a second drop ejector (304 and 408) associated with the firing chamber. The second drop ejector is configured to cause fluid having a second drop weight to be ejected from the firing chamber, wherein the second drop ejector includes a second heating element and second drive circuitry electrically coupled with the second heating element. The present embodiment further comprises a second bore (319) disposed within the orifice layer disposed proximate the second drop ejector, and the second bore is associated with the second drop ejector.
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Inventors:
Mark H. Mackenzie
Joseph M. Togason
Michael Dee Miller
Joseph M. Togason
Michael Dee Miller
Application Number:
JP2004069007A
Publication Date:
September 08, 2010
Filing Date:
March 11, 2004
Export Citation:
Assignee:
Hewlett-Packard Development Company
International Classes:
B41J2/05; B41J2/14; B41J2/21
Domestic Patent References:
| JP9254413A | ||||
| JP6198914A | ||||
| JP1081018A | ||||
| JP2001347663A |
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura