Title:
FLUORENE-CONTAINING RESIN
Document Type and Number:
Japanese Patent JP2004083855
Kind Code:
A
Abstract:
To provide a fluorene-containing resin which is a thermosetting or radiation curing functional epoxy resin, having a high hardness of cured material, heat resistance and electric characteristics in high levels and a low contraction rate on curing, and excellent in patterning property.
This specific epoxy resin and epoxy acrylate resin having fluorene skeleton, and the fluorene-containing alkali soluble radiation polymerizable unsaturated resin are provided.
Inventors:
KAWASAKI SHINICHI
MURASE HIROAKI
YAMADA MITSUAKI
MORITA TAKAYUKI
HOSOMI TETSUYA
TAMAKOSHI HIDEAKI
MURASE HIROAKI
YAMADA MITSUAKI
MORITA TAKAYUKI
HOSOMI TETSUYA
TAMAKOSHI HIDEAKI
Application Number:
JP2003140997A
Publication Date:
March 18, 2004
Filing Date:
May 19, 2003
Export Citation:
Assignee:
OSAKA GAS CO LTD
NAGASE CHEMTEX CORP
NAGASE CHEMTEX CORP
International Classes:
C08G59/04; C08G59/17; (IPC1-7): C08G59/04; C08G59/17
Domestic Patent References:
| JPH0940744A | 1997-02-10 | |||
| JPH03106918A | 1991-05-07 | |||
| JPH0640155A | 1994-02-15 | |||
| JPH1036485A | 1998-02-10 | |||
| JPH11242330A | 1999-09-07 | |||
| JP2001206862A | 2001-07-31 | |||
| JP2001196366A | 2001-07-19 | |||
| JP2001259014A | 2001-09-25 | |||
| JP2001070437A | 2001-03-21 | |||
| JP2001166469A | 2001-06-22 |
Attorney, Agent or Firm:
Hiromichi Nanjo
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