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Title:
FLUORINATED POLYAMIC ACID RESIN COMPOSITION FOR OPTICAL MATERIAL
Document Type and Number:
Japanese Patent JP2007084794
Kind Code:
A
Abstract:

To find a compound capable of reducing a light absorption at 1.49 μm and a light absorption extending from 1.35 μm to visible light, even if the baking temperature is ≤340°C and to provide a fluorinated polyamic acid resin composition for optical materials containing the compound.

A fluorinated polyamic acid resin composition for optical materials contains a fluorinated polyamic acid and a non-polycondensable compound (A) with an aromatic ring having a boiling point of ≤340°C, and the resin composition is used for obtaining a fluorinated polyimide membrane by a baking process.


Inventors:
MAKINO TOMOMI
TAJIRI KOZO
Application Number:
JP2006216136A
Publication Date:
April 05, 2007
Filing Date:
August 08, 2006
Export Citation:
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Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
C08L79/08; C08J5/18; C08K5/00; G02B6/12
Domestic Patent References:
JPH11147955A1999-06-02
JPH04328504A1992-11-17
JP2004269591A2004-09-30
JPH04122729A1992-04-23
JPH06207014A1994-07-26
Attorney, Agent or Firm:
Kyuichi Ueki
Tadashi Sugakawa
Osamu Futakuchi
Hiroaki Ito