To provide a resist composition that forms a pattern by using a high energy beam or electron beam having a wavelength of 300 nm or less, and to provide a resin that is used for a topcoat composition in immersion lithography and has water repellency, especially a large receding contact angle.
There is provided a fluorine-containing polymer of a mass average molecular weight of 1,000-1,000,000 having a repeating unit (a) represented by general formula (2), (wherein R1 indicates a group containing a polymerizable double bond; R2 indicates a fluorine atom or a fluorine-containing alkyl group; R8 indicates a substituted or unsubstituted alkyl group or the like; and W1 indicates a single bond, an unsubstituted or substituted methylene group or the like).
HAGIWARA YUJI
NAGAMORI MASASHI
ISONO YOSHIMI
NARIZUKA SATOSHI
MAEDA KAZUHIKO
| JP2010204187A | 2010-09-16 |