Title:
FLUORORESIN FIBER SHEET, METAL-CLAD SUBSTRATE FOR PRINTED CIRCUIT BOARD USING THE SHEET AND METHOD FOR PRODUCING THE BOARD
Document Type and Number:
Japanese Patent JP2004091948
Kind Code:
A
Abstract:
To provide a metal-clad substrate which scarcely has the partial irregularity of relative dielectric constant and dielectric loss tangent and has a high adhesive force between the metal foil and the substrate and whose surface is smooth in a state free from fine evenness.
This fluororesin fiber sheet comprising at least two kinds of fluroresin fibers A and B having different melting points, respectively, and heat-resistant insulating fibers is characterized in that the melting point MpA of the fluroresin fibers A and the MpB of the fluroresin fibers B satisfy the following expression (1): MpA-MpB>0 (1).
Inventors:
TSUDA OSAMU
SUZUKI TAKANORI
SUZUKI TAKANORI
Application Number:
JP2002252562A
Publication Date:
March 25, 2004
Filing Date:
August 30, 2002
Export Citation:
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
B32B15/082; B32B15/08; B32B15/14; D21H13/14; D21H13/40; H05K1/03; (IPC1-7): D21H13/14; B32B15/08; B32B15/14; D21H13/40; H05K1/03
Domestic Patent References:
JP2001283640A | 2001-10-12 | |||
JPS4212287B1 | ||||
JPH0379343A | 1991-04-04 | |||
JPH06344503A | 1994-12-20 | |||
JP2001032189A | 2001-02-06 |