Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FLUORORESIN FIBER SHEET, METAL-CLAD SUBSTRATE FOR PRINTED CIRCUIT BOARD USING THE SHEET AND METHOD FOR PRODUCING THE BOARD
Document Type and Number:
Japanese Patent JP2004091948
Kind Code:
A
Abstract:

To provide a metal-clad substrate which scarcely has the partial irregularity of relative dielectric constant and dielectric loss tangent and has a high adhesive force between the metal foil and the substrate and whose surface is smooth in a state free from fine evenness.

This fluororesin fiber sheet comprising at least two kinds of fluroresin fibers A and B having different melting points, respectively, and heat-resistant insulating fibers is characterized in that the melting point MpA of the fluroresin fibers A and the MpB of the fluroresin fibers B satisfy the following expression (1): MpA-MpB>0 (1).


Inventors:
TSUDA OSAMU
SUZUKI TAKANORI
Application Number:
JP2002252562A
Publication Date:
March 25, 2004
Filing Date:
August 30, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOMOEGAWA PAPER CO LTD
International Classes:
B32B15/082; B32B15/08; B32B15/14; D21H13/14; D21H13/40; H05K1/03; (IPC1-7): D21H13/14; B32B15/08; B32B15/14; D21H13/40; H05K1/03
Domestic Patent References:
JP2001283640A2001-10-12
JPS4212287B1
JPH0379343A1991-04-04
JPH06344503A1994-12-20
JP2001032189A2001-02-06