Title:
FLUX COMPOSITION AND CORRESPONDING SOLDERING METHOD
Document Type and Number:
Japanese Patent JP3132745
Kind Code:
B2
Abstract:
PURPOSE: To obtain a novel flux composition for soldering electronic components onto printed circuit boards.
CONSTITUTION: The novel flux composition contains pimelic acid, a first solvent, such as, for example, isopropyl alcohol, which dissolves the pimelic acid and a second solvent, such as, for example, propylene glycol monobutyl ether, which has a boiling point higher than the boiling point thereof. The novel flux composition does not leave any ionic residues at all at the completion of a soldering stage used to mount the electronic components on the printed circuit boards. Then, there is no need for a flux removal stage after the completion of the soldering stage. The occurrence of problems, such as corrosion and shorting in the circuits is averted.
Inventors:
Roy Lynn Aalto
Susan Hanselka Downey
Harry james golden
Issa Said McMood
Clement Aindu Okoro
James Spalik
Susan Hanselka Downey
Harry james golden
Issa Said McMood
Clement Aindu Okoro
James Spalik
Application Number:
JP12815495A
Publication Date:
February 05, 2001
Filing Date:
May 26, 1995
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
B23K35/36; C07C55/16; H05K3/34; B23K35/363; (IPC1-7): B23K35/363; H05K3/34
Domestic Patent References:
| JP377793A | ||||
| JP4262893A | ||||
| JP6503039A |
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)