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Title:
FLUX COMPOSITION FOR SOLDER AND ELECTRONIC SUBSTRATE PREPARED USING THE SAME
Document Type and Number:
Japanese Patent JP2014195825
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flux composition for solder which can remove a flux residue by water washing even when a solder temperature is high, and also prevent metal corrosion.SOLUTION: A flux composition for solder comprises (A) an ester compound of polyglycerol and 8-12C fatty acid, (B) organic solvent, and (C) oxalic acid.

Inventors:
KUMAKURA ICHIRO
NAKANAMI KAZUTAKA
OGAWA YASUTAKA
Application Number:
JP2013073471A
Publication Date:
October 16, 2014
Filing Date:
March 29, 2013
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363; B23K1/00
Domestic Patent References:
JPH1177376A1999-03-23
JP2004158728A2004-06-03
JPH04262893A1992-09-18
JPH1085985A1998-04-07
JPH03152803A1991-06-28
Foreign References:
WO2007034758A12007-03-29
Attorney, Agent or Firm:
Bottom intellectual property office of patent business corporation Tatsuyuki



 
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