Title:
フラックス、フラックス付き低融点合金およびそれを用いた保護素子
Document Type and Number:
Japanese Patent JP4488586
Kind Code:
B2
Inventors:
Terazawa Seito
Application Number:
JP2000151078A
Publication Date:
June 23, 2010
Filing Date:
May 23, 2000
Export Citation:
Assignee:
NEC Shot Components Co., Ltd.
International Classes:
B23K35/363; C08L93/04; H01H37/76; H01H85/00; H01H85/048; H01H85/06; H01H85/17
Domestic Patent References:
| JP11073869A | ||||
| JP7164183A | ||||
| JP8236305A | ||||
| JP11213852A |