Title:
FLUX FOR SOLDERING, AND ELECTRONIC CIRCUIT
Document Type and Number:
Japanese Patent JP2004042050
Kind Code:
A
Abstract:
To restrain the diffusion of nickel into molten solder alloy when the soldering is performed, to improve the joined strength of the soldering by preventing the concentration increase of phosphorus and to restrain the reduction-precipitation of silver and/or copper into a part except an circuit pattern.
In a flux used when the soldering is performed in the circuit applied to a non-electrolytic nickel plating or further applying a gold-plating on the non-electrolytic nickel plating, one or more kinds of complexes of the silver ion and/or the copper ion are contained in this flux.
More Like This:
| JPS56119663 | SOLDERING DEVICE |
| JPH09116260 | METHOD AND AUXILIARY APPARATUS FOR REMOVING PARTS |
Inventors:
IKEDA KAZUTERU
ISHIKAWA SHUNSUKE
ANADA TAKAAKI
OBATA KEIGO
TAKEUCHI TAKAO
INOUE NAOYA
ISHIKAWA SHUNSUKE
ANADA TAKAAKI
OBATA KEIGO
TAKEUCHI TAKAO
INOUE NAOYA
Application Number:
JP2002199423A
Publication Date:
February 12, 2004
Filing Date:
July 09, 2002
Export Citation:
Assignee:
HARIMA CHEMICALS INC
DAIWA FINE CHEMICALS CO LTD LA
DAIWA FINE CHEMICALS CO LTD LA
International Classes:
B23K3/00; B23K35/363; H05K3/34; (IPC1-7): B23K35/363; B23K3/00; H05K3/34
Domestic Patent References:
| JP2000034593A | 2000-02-02 | |||
| JP2000073191A | 2000-03-07 | |||
| JPH0615483A | 1994-01-25 | |||
| JPH0890285A | 1996-04-09 | |||
| JPH08155677A | 1996-06-18 | |||
| JPH05392A | 1993-01-08 | |||
| JP2002361484A | 2002-12-18 |
Foreign References:
| WO2001080611A1 | 2001-10-25 |
Attorney, Agent or Firm:
Hero Takeyasu