Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FOCUS RING FOR PLASMA ETCHING DEVICE
Document Type and Number:
Japanese Patent JPH10218664
Kind Code:
A
Abstract:

To provide a focus ring for a plasma etching device comprising a vitrified carbon material little in consumption when etching and excellent in yield of products.

This focus ring for plasma etching device is composed of a vitrified carbon material satisfying the formula R≥(d002-3.344)/0.135 in the relation between a relative intensity ratio R (IA/IB) of the spectrum intensity (IA) appearing in 1360±100cm-1 band region and the spectrum intensity (IB) appearing in 1580±100cm-1 band region in a Raman spectrum analysis by using argon laser beam of 5145 angstrom, and the average lattice spacing (d002) (angstrom) of graphite hexagonal net plane layer. Preferably, the relative intensity ratio R is regulated so as to be 1.0-2.0 and the average lattice spacing d002 is regulated so as to be 3.40-3.60.


Inventors:
UEI TOSHIHARU
NOBATA MITSUHARU
Application Number:
JP3703597A
Publication Date:
August 18, 1998
Filing Date:
February 05, 1997
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKAI CARBON KK
International Classes:
C04B35/52; C01B31/02; C23F4/00; H01L21/302; H01L21/3065; (IPC1-7): C04B35/52; C01B31/02; C23F4/00; H01L21/3065
Attorney, Agent or Firm:
Fukuda Yasuo (1 person outside)