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Title:
集束イオンビーム装置及び断面加工観察方法
Document Type and Number:
Japanese Patent JP5763298
Kind Code:
B2
Abstract:

To perform cross-sectional processing observation which enables observing a cross-section of an observation object structure, including a sample having a periodic structure.

A focused ion beam device includes a focused ion beam irradiation system 1 irradiating the sample 5 with a focused ion beam 3; a charged particle beam irradiation system 2 irradiating a focused ion beam irradiation region on the sample 5 with a charged particle beam 4; a secondary charged particle detector 7a detecting secondary charged particles to be generated from the sample 5; and a processing mechanism 11 sending an irradiation signal of the focused ion beam 3 creating cross-sections at different cross-section intervals to the focused ion beam irradiation system 1.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
Toshiaki Fujii
Junichi Tashiro
Keiichi Tanaka
Application Number:
JP2010053234A
Publication Date:
August 12, 2015
Filing Date:
March 10, 2010
Export Citation:
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Assignee:
Hitachi High-Tech Science Co., Ltd.
International Classes:
G01N1/28; H01J27/26; H01J37/08; H01J37/20; H01J37/28; H01J37/317
Domestic Patent References:
JP2006221961A
JP2007333682A
JP9259810A
JP2005122909A
JP11273613A
JP2001264225A
JP9115473A
JP2006228593A
JP8115699A
JP2008270073A
JP10221227A
JP2008205341A
Attorney, Agent or Firm:
Patent business corporation glory patent office



 
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