Title:
SEALING COMPOUND
Document Type and Number:
Japanese Patent JP3143676
Kind Code:
B2
Abstract:
PURPOSE: To obtain a sealing compound, excellent in heat resistance, heat cycle characteristics, light transmissivity, long-period reliability and adhesion to lead frames, etc., by hydrogenating a polymer prepared by carrying out ring opening polymerization of a (co)monomer, etc., composed of a norbornene derivative.
CONSTITUTION: A polymer prepared by ring opening polymerization of a monomer composed of one or more norbornene derivatives expressed by the formula (A and B are H or 1-10C hydrocarbon; C and D are H or monofunctional organic group) or the above-mentioned monomer and a comonomer copolymerizable therewith is further hydrogenated to afford a hydrogenated polymer having 0.3-1.5 dl/g intrinsic viscosity measured at 30°C in chloroform, 100-210°C glass transition temperature and 8000-200000 weight-average molecular weight. The resultant hydrogenated polymer is used as a sealing compound.
Inventors:
Hironobu Shinohara
Application Number:
JP17166591A
Publication Date:
March 07, 2001
Filing Date:
June 17, 1991
Export Citation:
Assignee:
JSR Corporation
International Classes:
C08G61/08; B29C45/00; C08G61/06; H01L23/29; H01L23/31; (IPC1-7): C08G61/08; H01L23/29; H01L23/31
Domestic Patent References:
| JP1240517A | ||||
| JP50111200A |
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