Title:
FORMATION OF BUMP
Document Type and Number:
Japanese Patent JPH07142489
Kind Code:
A
Abstract:
PURPOSE: To provide a method for forming bumps on the surface of a chip or a substrate at low cost.
CONSTITUTION: A solder wire is cut off at a predetermined length and vacuum sucked to the rear surface of a pickup head. It is then transferred onto the surface of a chip 5 and fused thermally. Subsequently, it is cooled and solidified to form a hemispherical bump 11a. This method allows formation of bumps 11a easily on the chip 5 or the like easily using an inexpensive solder wire.
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Inventors:
SAKAMI SEIJI
SAKAI TADAHIKO
SAKAI TADAHIKO
Application Number:
JP28802293A
Publication Date:
June 02, 1995
Filing Date:
November 17, 1993
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K3/06; H01L21/48; H01L21/60; H05K3/34; (IPC1-7): H01L21/321; H01L21/60
Attorney, Agent or Firm:
Akira Kobiji (2 outside)