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Patent Searching and Data


Title:
FORMATION OF FILM IN SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS58147034
Kind Code:
A
Abstract:
PURPOSE:To perform patterning on a second film by covering a first film pattern on a substrate with a second film, heating component under the ambient condition containing specified gas, gasifing or vaporizing or sublimating the product by reaction with the first film and removing the second film placed on the first film. CONSTITUTION:A pattern 5 of Mo etc. is provided on a Si substrate 1. After it is purified, the pattern is covered with a SiO2 film 6 by the CVD method. An intermediate device is momentarily dipped into the HF solution, a groove is formed along the outside of pattern 5, and it is heated up to 500 deg.C or higher in the O2 ambient in order to form a Mo oxide. The Mo oxide is immediately gasified or sublimated. Thereby the pattern 5 is lost. Therefore, a SiO2 film 6' on the pattern 5 can be easily removed by spraying water or N2 and a pattern of film 6 can be formed. The film 6 may be Al2O3 or Si3N4 and Mo can be replaced with W. In case Al, Ti are sued, they can be processed in the same way by heating them up to 200 deg.C or higher under the ambient atmosphere containing Cl2.

Inventors:
YAMAUCHI NORIYOSHI
TANIUCHI TOSHIAKI
WADA TSUTOMU
TERAJIMA MAKOTO
Application Number:
JP2879582A
Publication Date:
September 01, 1983
Filing Date:
February 26, 1982
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
H01L21/302; H01L21/033; H01L21/3065; (IPC1-7): H01L21/306
Attorney, Agent or Firm:
Toshio Takayama