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Patent Searching and Data


Title:
FORMATION OF HEAT-INSULATING SYNTHETIC BOARD
Document Type and Number:
Japanese Patent JPS60229708
Kind Code:
A
Abstract:

PURPOSE: To form a synthetic wooden board with lesser warping and distortion by a method in which cellulosic short fibers are temporarily pressed for molding and then bonded with a decorating material.

CONSTITUTION: Wood chips, pulp, etc., are dried, impregnated with a resin liquid, dried, and then broken to obtain an aggregate 1. A base material formed by mixing the aggregate 1 and fibers 2 or the base material with a net cloth 3 is temporarily hot- or cold-pressed to cause the integral adherence of the aggregate 1 and the entanglement of the fibers 2 and the net cloth 3. A decorating material 4 (e.g., plywood, Victoria lawn, etc.) is then bonded to the surface of the molding so obtained without the aid of any adhesive means and pressed for molding to form a synthetic wooden board free of warping and distortion.


Inventors:
NISHIBORI SADAO
Application Number:
JP8409484A
Publication Date:
November 15, 1985
Filing Date:
April 27, 1984
Export Citation:
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Assignee:
AIN ENGINEERING KK
International Classes:
B27N3/04; B27N3/06; (IPC1-7): B27N3/06
Domestic Patent References:
JPS51112884A1976-10-05
JPS58102759A1983-06-18
JP38006634A
Attorney, Agent or Firm:
Minoru Kuwahara