Title:
FORMATION OF MULTI-LAYERED RESIST FILM
Document Type and Number:
Japanese Patent JPH0262548
Kind Code:
A
Abstract:
PURPOSE: To prevent cracking and to obtain a uniform multi-layered resist pattern of high quality by setting the heating temperature of a resist film for flattening above the heating temperature of an SOG film.
CONSTITUTION: A desired substrate 11 is coated with the resist 12 for flattening and a heat treatment is carried out. This heating temperature is higher than the heating temperature of a next SOG film 13. The SOG film is coated with resist 14 containing a photosensitive material to form a multi-layered resist film. This constitution eliminate unwanted cracking in the SOG film 13 to form the uniform multi-layered resist pattern of high quality.
Inventors:
SUGIMOTO NAOAKI
Application Number:
JP21444888A
Publication Date:
March 02, 1990
Filing Date:
August 29, 1988
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G03F7/11; G03F7/26; H01L21/027; (IPC1-7): G03F7/11; G03F7/26; H01L21/027
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)
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