PURPOSE: To provide the method for forming a terminal electrode which produces no bad conduction of a through hole nor a short across a rear electrode by forming uniformly a through-hole electrode on the surface of an inner wall of the through hole of an insulated substrate having a through hole when forming a terminal electrode of a multielement electronic component or a thick- film hybrid IC.

CONSTITUTION: On an insulated substrate 4 having a dividing groove 3 for dividing the substrate into individual pieces and a through hole 2 which, crossing the dividing groove 3, passes through the substrate from the front surface to the rear surface, conductor paste is so printed that a pattern keeps away from intersections between the dividing groove 3 and the circumference of the through hole 2 and the pattern width is smaller in the through hole than in any other parts, getting smaller and smaller as the pattern moves or towards the center of the through hole. At the same time, the conductor paste is sucked from the rear surface. By this method, the conductor paste 1 is stably cut at the center of the through hole 2 where the pattern width is smallest and thereby a through hole electrode can be formed uniformly on the surface of an inner wall of the through hole 2.