Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FORMATION OF VAPOR PHASE FILM
Document Type and Number:
Japanese Patent JPH0625834
Kind Code:
A
Abstract:

PURPOSE: To suppress defects, such as pinholes, and to form denser vapor phase films by making combination use of materials which are completely evaporated with materials which are liable to generate coarse particles at the time of depositing these materials by vacuum evaporation.

CONSTITUTION: A target 1-b for vapor deposition consisting of materials (SiO2, Al2O3, etc.) which are completely evaporated is used in combination with a target 1-a for evaporation composed of the materials (SiC, AlN, etc.) which are liable to generate the coarse particles at the time of subjecting these materials to vacuum vapor deposition by high-energy beams. These targets 1-a, 1-b are irradiated with the laser beams 2-a, 2-b respectively in a vacuum and vapor phase films 14 are formed on a substrate 4 by the evaporated particles 12-a, 13-b generated in such a manner. The SiC and the SiO2, are so evaporated that the weight ratio (%) of the SiO2 to the SiC attains about 0.2 to 2 times when for example, the SiC and the SiO2, are combined. The vapor phase film 14 improved in strength and sticking force to the substrate 4 is formed in such a manner.


Inventors:
OKA KAZUHIRO
Application Number:
JP20320192A
Publication Date:
February 01, 1994
Filing Date:
July 08, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C23C14/28; (IPC1-7): C23C14/28
Attorney, Agent or Firm:
Soga Doteru (6 people outside)