Title:
FORMATION OF WIRING IN SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPH06291120
Kind Code:
A
Abstract:
PURPOSE: To provide a method for forming a wiring in a semiconductor element in which reliability of wiring is enhanced by decreasing the resistance of wiring gradually toward the surface.
CONSTITUTION: The method for fabricating a semiconductor element comprises a step for forming a lower substrate, a step for forming a main wiring, i.e., a W wiring 204, on the lower substrate, and a step for forming a Cu film 205 having a lower resistivity than the W wiring 204 thereon.
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Inventors:
UMEMURA EIICHI
Application Number:
JP7492093A
Publication Date:
October 18, 1994
Filing Date:
April 01, 1993
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L23/52; H01L21/3205; (IPC1-7): H01L21/3205
Attorney, Agent or Firm:
Mamoru Shimizu (2 outside)