Title:
FORMING BALL SECTION ON SOLDERING WIRE
Document Type and Number:
Japanese Patent JP3248778
Kind Code:
B2
Abstract:
PURPOSE: To form an approx. sphere-shaped ball section 1a, 1b on a soldering wire 1 in one unit with an oxide film being suppressed to appear on the surface of the ball section.
CONSTITUTION: A soldering wire 1 is arranged approx. at a right angle, so that it extends in upward and downward-directions, and a no-oxygen gas flow 7, which is heated to a temperature that is lower than the melting point of the soldering wire, is formed from down to upward direction around that soldering wire 1, and, on the other hand, the combustion flame 9 of mix gas of hydrogen and oxygen is brought closer to, and then, moved away from the outside circumference of the non-oxygen gas flow 7.
Inventors:
Miki Hasegawa
Chojiro Kuriyama
Chojiro Kuriyama
Application Number:
JP11994093A
Publication Date:
January 21, 2002
Filing Date:
May 21, 1993
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
B23K35/02; H01L21/60; B23K35/14; (IPC1-7): H01L21/60
Domestic Patent References:
| JP61253825A | ||||
| JP5326602A | ||||
| JP6140455A | ||||
| JP6244233A | ||||
| JP5871465U |
Attorney, Agent or Firm:
Akio Ishii (2 outside)
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