To provide a forming method of conductive joint by applying a technique of forge welding for bonding a metal surface of a metal layer to a conductive bonding layer, when conductive-bonding the surfaces of two metal layers via a conductive bonding layer composed of metallic nanoparticles.
A dispersion liquid of metallic nanoparticles having a molecular layer of a coating agent on the surface thereof is coated on the metal surface of one of metal layers. Then, an organic solvent contained in the coated layer is vaparized to obtain a dry coated layer. The conductive bonding layer is formed by removal of the molecular layer of the coating agent and interactive fusion of metallic nanoparticles through heat treatment at 150°C and under in an atmosphere of high-frequency plasma. A metallic bonding is formed between the surface of the conductive bonding layer and the surface of the metal composing the other metal layer, by applying a heat treatment at 100°C-200°C while forcibly pressing the metal surface of the other metal layer on the surface of the conductive bonding layer.
MATSUBA YORISHIGE
| JPH09326416A | 1997-12-16 | |||
| JP2004247572A | 2004-09-02 | |||
| JP2005135982A | 2005-05-26 | |||
| JP2005093814A | 2005-04-07 | |||
| JP2002334618A | 2002-11-22 | |||
| JP2004146731A | 2004-05-20 |
| WO2002035554A1 | 2002-05-02 |
Ishibashi Masayuki
Shinichi Iwata
Masaaki Ogata
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