Title:
FORMING METHOD FOR PATTERN
Document Type and Number:
Japanese Patent JPS58157135
Kind Code:
A
Abstract:
PURPOSE:To prevent the deviation in pattern dimensions and the attendant lowered resolution by a method wherein treatment to prevent melting and mixing is performed for the surface of a first resin film for the isolation thereof from a second resin film and the two films are simultaneously subjected to patterning, when two layers of radiation-sensitive resin are applied. CONSTITUTION:A layer 5 of positive type UV sensitive resin (positive UV photoresist) is applied to a substrate 4, subjected to soft baking, and then exposed to a UV beam 6. Fluorine-base glass plasma 7 is so applied to the surface of the exposed UV photoresist 5a that a modified layer 5b is produced with its sensitivity to light not being degraded. A second positive UV photoresist 8 is applied to the modified layer 5b and subjected to baking. Due to the modified layer 5b, a lamination of completely isolated layers can be formed. Through a mask 9, a UV beam 11 is directed at the lamination, except where the beam 11 is blocked by Cr sections 10, for selective and simultaneous processing.
Inventors:
SASAKO MASARU
TSUJI KAZUHIKO
TSUJI KAZUHIKO
Application Number:
JP4127382A
Publication Date:
September 19, 1983
Filing Date:
March 15, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/027; G03F7/20; G03F7/26; G03F7/38; H01L21/30; (IPC1-7): H01L21/30
Attorney, Agent or Firm:
Akira Kobiji (2 outside)