To provide a forming method of a transparent conductive film pattern in which damage by a chemical solution is reduced and a process is simplified, and the forming method of a metal thin film pattern.

A printed resin layer 2a that is the resin layer patternized by an inversion printing method is formed on a substrate 6 on which a color filter layer is installed, and an ITO membrane 7 is film-formed on the printed resin layer 2a thus formed. The ITO membrane 7 is patternized by lifting-off the printing resin layer 2a. The printed resin layer 2a is preferably formed in a reverse taper form against the surface of the substrate 6.