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Title:
FREE RADICAL CURING RESIN COMPOSITION AND CIVIL ENGINEERING BUILDING MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2003268054
Kind Code:
A
Abstract:

To provide a free radical curing resin composition having excellent low malodor properties, room temperature curability, low-temperature curability and surface appearance, suppressing evaporation and malodors of a monomer in a liquid state or during curing from a liquid state into a solid and having a short curing time and excellent low-temperature curability and a civil engineering building material using the same.

The free radical curing resin composition comprises (A) a resin having at least ≥2 (meth)acryloyl groups at the molecular terminals, (B) a monomer having (meth)acryloyl group and (C) an acetyllatone compound. The free radical curing resin composition comprises preferably (D) a free radical polymerizable unsaturated group-containing resin having air drying properties and/or (E) a paraffin wax.


Inventors:
MATSUMOTO TAKASHI
KANZAKI MITSUYUKI
TASHIRO RIE
Application Number:
JP2002071955A
Publication Date:
September 25, 2003
Filing Date:
March 15, 2002
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08F290/06; C08F299/02; (IPC1-7): C08F290/06; C08F299/02
Attorney, Agent or Firm:
Takahashi victory