Title:
完全にアライメント調整されたサブトラクティブプロセス及びその電子デバイス
Document Type and Number:
Japanese Patent JP7393437
Kind Code:
B2
Abstract:
Methods of forming fully aligned vias connecting two metal lines extending in two directions are described. The fully aligned via is aligned with the first metal line and the second metal line along both directions. A third metal layer is patterned on a top of a second metal layer in electrical contact with a first metal layer. The patterned third metal layer is misaligned from the top of the second metal layer. The second metal layer is recessed to expose sides of the second metal layer and remove portions not aligned sides of the third metal layer.
Inventors:
Ren, Ho
Jean, Hao
Naiku, Mayur
Jean, Hao
Naiku, Mayur
Application Number:
JP2021564181A
Publication Date:
December 06, 2023
Filing Date:
May 01, 2020
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/3213; H01L21/768; H01L23/522; H01L23/532; H10B10/00; H10B12/00
Domestic Patent References:
| JP2005150439A | ||||
| JP6021234A | ||||
| JP2003264192A | ||||
| JP2018056227A | ||||
| JP2008538591A |
Foreign References:
| US20120329275 |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation
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