Title:
FUSED SOLDER ADSORBENT
Document Type and Number:
Japanese Patent JPH0677641
Kind Code:
A
Abstract:
PURPOSE: To obtain an inexpensive fused solder adsorbent exhibiting high solder paste suction efficiency which can be adapted well to high density wiring pattern and automated work and can be shaped into a plate easily.
CONSTITUTION: Fine powder of metal or metal oxide is adhered onto the surface of a network foamable resin which is then thermally decomposed in a reducing atmosphere and removed thus producing a three-dimensional network metallic porous material. The metallic porous material is then shaped into a sheet or a coil.
Inventors:
NISHIDA JUN
FUJITA KATSUMI
FUJITA KATSUMI
Application Number:
JP22862792A
Publication Date:
March 18, 1994
Filing Date:
August 27, 1992
Export Citation:
Assignee:
JAPAN METALS & CHEM CO LTD
International Classes:
H05K3/34; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Junzo Ogawa (1 person outside)
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