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Title:
GAS BARRIER MOLDING
Document Type and Number:
Japanese Patent JP2012086436
Kind Code:
A
Abstract:

To provide a gas barrier molding in which low temperature treatment can be performed without using an expensive vacuum device by using a silazane compound, and gas barrier performance equal to that of a silica membrane obtained by an evaporation method is imparted to a synthetic resin molding.

The gas barrier molding has the synthetic resin molding 1 and the silica membrane which is formed at part or the whole of the surface of the synthetic resin molding, the silica member uses the silazane compound as a precursor, and the gas barrier molding is formed by applying ultra-ray irradiation and heat treatment to the silazane compound simultaneously.


Inventors:
WATABE HIDETOSHI
TADAOKA EISUKE
Application Number:
JP2010234460A
Publication Date:
May 10, 2012
Filing Date:
October 19, 2010
Export Citation:
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Assignee:
HITACHI CHEMICAL TECHNO SERVICE CO LTD
HITACHI CHEMICAL CO LTD
International Classes:
B32B9/00
Domestic Patent References:
JPH11166157A1999-06-22
JP2009255040A2009-11-05
JP2011194766A2011-10-06
JP2009503157A2009-01-29
JPH0971409A1997-03-18
JP2005281368A2005-10-13
JP2004212900A2004-07-29
Foreign References:
WO2010024378A12010-03-04
Attorney, Agent or Firm:
Kazuyasu Minagawa



 
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