Title:
GAS BARRIER MOLDING
Document Type and Number:
Japanese Patent JP2012086436
Kind Code:
A
Abstract:
To provide a gas barrier molding in which low temperature treatment can be performed without using an expensive vacuum device by using a silazane compound, and gas barrier performance equal to that of a silica membrane obtained by an evaporation method is imparted to a synthetic resin molding.
The gas barrier molding has the synthetic resin molding 1 and the silica membrane which is formed at part or the whole of the surface of the synthetic resin molding, the silica member uses the silazane compound as a precursor, and the gas barrier molding is formed by applying ultra-ray irradiation and heat treatment to the silazane compound simultaneously.
Inventors:
WATABE HIDETOSHI
TADAOKA EISUKE
TADAOKA EISUKE
Application Number:
JP2010234460A
Publication Date:
May 10, 2012
Filing Date:
October 19, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL TECHNO SERVICE CO LTD
HITACHI CHEMICAL CO LTD
HITACHI CHEMICAL CO LTD
International Classes:
B32B9/00
Domestic Patent References:
JPH11166157A | 1999-06-22 | |||
JP2009255040A | 2009-11-05 | |||
JP2011194766A | 2011-10-06 | |||
JP2009503157A | 2009-01-29 | |||
JPH0971409A | 1997-03-18 | |||
JP2005281368A | 2005-10-13 | |||
JP2004212900A | 2004-07-29 |
Foreign References:
WO2010024378A1 | 2010-03-04 |
Attorney, Agent or Firm:
Kazuyasu Minagawa