To eliminate requirement of any through hole, and shorten width of an electrode terminal without reducing machine strength of a panel even when an electrode terminal pitch is shorter than a thickness of a substrate to reduce non-display part during a panel arrangement, by forming the electrode terminal connected with an electrode on a side surface of a front substrate or a rear substrate.

An electrode 3 formed on a front substrate 1 is transferred under a sealing glass 7, is guided to a side surface 32 of the front substrate 1, and connected with an electrode terminal 31 formed on the side surface 32. The electrode terminal 31 is connected with a circuit substrate on the backside of a panel through an anisotropic conductive film 34 and a flexible printed circuit FPC 33. The exposed electrode terminal 31 and the anisotropic conductive film 34 are sealed by a resin layer 35 for preventing short circuit under dew condensation. A width of non-display portion from a display portion to the side surface of the panel equals to summation of width of an adhering glass 7 and thickness of an electrode-drawing portion 41 constituted with the anisotropic conductive film 34, the FPC 33, and a resin layer 35, can be extremely reduced. An end of the substrate has no through hole, mechanical strength does not decrease, and it is strong against impact.