GAS-LIQUID SEPARATOR AND SUBSTRATE TREATMENT DEVICE

Japanese Patent JP2015193054

A

PROBLEM TO BE SOLVED: To provide a miniaturized gas-liquid separator for a substrate treatment device with a plurality of polishing units and the substrate treatment device equipped with the gas-liquid separator.SOLUTION: A gas-liquid separator 300 is provided with a housing. In the housing: first introduction port 312A, 312B and second introduction ports 316A, 316B introducing gas-liquid two-phase flows generated in a plurality of respective polishing units for polishing a substrate are formed; liquid phase discharge ports 314A, 314B for discharging a liquid phase separated from the gas-liquid two-phase flows within the housing are formed; and gas phase discharge ports 318A, 318B for discharging a gas phase separated from the gas-liquid two-phase flows within the housing are formed.

JP2013043243	POLISHING BODY, AND POLISHING METHOD USING THE SAME
JP5533666	Polishing equipment, polishing method, and glass plate manufacturing method
WO/1993/025347	WAFER POLISHING METHOD AND APPARATUS

SONE CHUICHI
AONO HIROSHI
SHINKAI TAKESHI
AIZAWA HIDEO

JP2014072223A

November 05, 2015

March 31, 2014

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EBARA CORP

B24B37/34; B01D19/00; B24B7/00; B24B57/00

Shinjiro Ono
Toru Miyamae
Yamazaki Kosaku
Yukio Kanegae
Koichi Kushida
Takahiko Ieari

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