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Title:
樹脂封止半導体装置のリード部のゲートブレーク方法
Document Type and Number:
Japanese Patent JP4106844
Kind Code:
B2
Abstract:
A molding equipment for a resin shielding semiconductor device includes a lower platen having a lower cavity, and an upper platen having an upper cavity, and a recess which is adjacent to the upper cavity. A lead frame has an opening serving as a passage of resin. The opening has one end rounded.

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Inventors:
Kazuaki Yoshiike
Application Number:
JP2000044478A
Publication Date:
June 25, 2008
Filing Date:
February 22, 2000
Export Citation:
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Assignee:
Oki Electric Industry Co., Ltd.
International Classes:
H01L21/56; B29C45/14; B29C45/26; B29C45/38; B29C45/40; B29L31/34
Domestic Patent References:
JP10016010A
JP8090605A
JP10223663A
JP10154718A
Attorney, Agent or Firm:
Mamoru Shimizu
Makoto Kawai



 
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