GLASS-CERAMIC COMPOSITE AND FLAT PACKAGE TYPE PIEZOELECTRIC PARTS USING THE SAME

Title:

GLASS-CERAMIC COMPOSITE AND FLAT PACKAGE TYPE PIEZOELECTRIC PARTS USING THE SAME

Document Type and Number:

Japanese Patent JPH11302034

Kind Code:

A

Abstract:

To obtain high reliability piezoelectric parts by dispersing a specified amt. of forsterite in glass and providing a composite with a specified coefft. of thermal expansion.

The glass-ceramic composite is obtd. by dispersing 30-70 wt.% forsterite in glass and has a coefft. of thermal expansion of 100×10-7-150×10-7. The compsn. of the glass consists preferably of, by weight, 50-70% SiO2, 2-15% Al2O3, 5-30% (Rx)O (Rx is one or more elements selected from among Ca, Sr and Ba), 1-8% B2O3, 2-15% ZnO and 5-30% (Ry)2O (Ry is one or more elements selected from among Na, K and Li). One or more additives selected from among ZrO2, TiO2, SnO2, P2O5 and MoO3 are preferably added to the composite by 0.2-5 wt.% in the form of fine powder of 0.1-1 μm particle diameter.

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Inventors:

GOTO YOSHIHIRO
ISHIJIMA MASAYA
MORIZAKI YASUTOSHI

Application Number:

JP11038098A

Publication Date:

November 02, 1999

Filing Date:

April 21, 1998

Export Citation:

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Assignee:

KANSAI NIPPON ELECTRIC

International Classes:

C03C3/091; C03C3/097; C03C10/04; H01L23/04; H03H9/10; H03H9/25; (IPC1-7): C03C3/091; C03C3/097; C03C10/04; H01L23/04; H03H9/10; H03H9/25

Attorney, Agent or Firm:

Ichiro Kudo

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