Title:
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARDS
Document Type and Number:
Japanese Patent JP2023129413
Kind Code:
A
Abstract:
To provide a low dielectric glass cloth with a thickness of 16 μm or less, which has little waviness during prepreg coating, has an excellent handling property, has a resin impregnating property, and can form a uniform resin layer on a front and back side of the glass cloth; a prepreg using the low dielectric glass cloth; and a substrate for a printed wiring board.SOLUTION: There is provided a glass cloth that has a thickness of 8 μm or more and 16 μm or less, and is composed of a glass thread consisting of multiple glass filaments as warp and weft threads, wherein an average mass per unit length of the warp thread is 1.40×10-6 kg/m or more and less than 1.60×10-6 kg/m, an average mass per unit length of the weft thread is 1.60×10-6 kg/m or more and 3.00×10-6 kg/m or less, a ratio of the average mass per unit length of the weft thread to the average mass per unit length of the warp thread (weft/warp ratio) is 1.20 or more and 1.50 or less, and a density of the glass is 2.2 g/cm3 or more and 2.5 g/cm3 or less.SELECTED DRAWING: None
Inventors:
ENDO MASAO
KAKIZAKI HIROTAKA
KAKIZAKI HIROTAKA
Application Number:
JP2023104084A
Publication Date:
September 14, 2023
Filing Date:
June 26, 2023
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
B29B11/16; D03D1/00; D03D15/267; H05K1/03
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito