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Title:
GLASS FOR COVERING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP2013060353
Kind Code:
A
Abstract:

To provide glass which has a low environmental load, excellent chemical durability and low surface charge density and which is especially suitable for covering a semiconductor element for low withstanding voltage.

The glass for covering the semiconductor element is characterized by including, in mass% as glass composition, 52-65% ZnO, 5-20% B2O3, 15-35% SiO2 and 3-6% Al2O3 and not substantially containing lead. It is preferable that the glass composition additionally contains 0-5% Ta2O5, 0-5% MnO2, 0-5% Nb2O5, 0-3% CeO2 and Sb2O3.


Inventors:
NISHIKAWA YOSHIKATSU
Application Number:
JP2012132531A
Publication Date:
April 04, 2013
Filing Date:
June 12, 2012
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO
International Classes:
C03C8/04; C03C8/14; H01L21/316
Domestic Patent References:
JPS57202742A1982-12-11
JPS4843275A1973-06-22
JPS50129181A1975-10-13
JPH05301738A1993-11-16
JPS5117027B11976-05-29
JPS623039A1987-01-09
JPS6231903A1987-02-10
Foreign References:
WO2011093177A12011-08-04