Title:
GLASS FOR COVERING SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP2013060353
Kind Code:
A
Abstract:
To provide glass which has a low environmental load, excellent chemical durability and low surface charge density and which is especially suitable for covering a semiconductor element for low withstanding voltage.
The glass for covering the semiconductor element is characterized by including, in mass% as glass composition, 52-65% ZnO, 5-20% B2O3, 15-35% SiO2 and 3-6% Al2O3 and not substantially containing lead. It is preferable that the glass composition additionally contains 0-5% Ta2O5, 0-5% MnO2, 0-5% Nb2O5, 0-3% CeO2 and Sb2O3.
Inventors:
NISHIKAWA YOSHIKATSU
Application Number:
JP2012132531A
Publication Date:
April 04, 2013
Filing Date:
June 12, 2012
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO
International Classes:
C03C8/04; C03C8/14; H01L21/316
Domestic Patent References:
JPS57202742A | 1982-12-11 | |||
JPS4843275A | 1973-06-22 | |||
JPS50129181A | 1975-10-13 | |||
JPH05301738A | 1993-11-16 | |||
JPS5117027B1 | 1976-05-29 | |||
JPS623039A | 1987-01-09 | |||
JPS6231903A | 1987-02-10 |
Foreign References:
WO2011093177A1 | 2011-08-04 |
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