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Title:
ガラス基板のチャンファリング方法及び装置
Document Type and Number:
Japanese Patent JP4144725
Kind Code:
B2
Abstract:
A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced. Thus, edge portions of the glass substrate for a hard disk can be processed accurately, efficiently, and with high quality, and the need for a subsequent process, such as buff-polishing, is reduced or even eliminated.

Inventors:
Sei Omori
Muneaki Asami
Akihiko Uzawa
Sadamasa Kamiya
Application Number:
JP27897699A
Publication Date:
September 03, 2008
Filing Date:
September 30, 1999
Export Citation:
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Assignee:
RIKEN
New Generation Processing System Co., Ltd.
UTK System Co., Ltd.
SHIGIYA MACHINERY WORKS LTD.
International Classes:
B24B9/00; B24B9/06; B24B9/08; B24B53/00
Domestic Patent References:
JP11033889A
JP7132451A
JP4115867A
JP5305568A
JP11198012A
JP8057756A
JP2145258A
Attorney, Agent or Firm:
Minoru Hotta
Shigeru Nara