Title:
GOLD REMOVAL FROM ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2012157903
Kind Code:
A
Abstract:
To solve such a problem that in some environments, gold plating becomes brittle and can cause the failure of connections on electronic components.
In some embodiments, a method removes gold plating on an electronic component. The method includes: forming a gold and solder mixture on an electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.
Inventors:
HAFELI PAUL B
HOLZMAN ELI
STEIN AARON J
VARGAS MICHAEL
HOLZMAN ELI
STEIN AARON J
VARGAS MICHAEL
Application Number:
JP2011257636A
Publication Date:
August 23, 2012
Filing Date:
November 25, 2011
Export Citation:
Assignee:
RAYTHEON CO
International Classes:
B23K1/018; B23K1/20; B23K31/02; B23K101/36
Domestic Patent References:
| JP2004349489A | 2004-12-09 | |||
| JPH0685453A | 1994-03-25 | |||
| JPH04287957A | 1992-10-13 | |||
| JP2004351480A | 2004-12-16 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation