Title:
GOLD SUPPORT PARTICLE AND METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE FILM PREPARED USING THE GOLD SUPPORT PARTICLE AND METHOD FOR PRODUCING THE CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JP2012048949
Kind Code:
A
Abstract:
To provide a gold support particle including a gold particle monodispersed on a support particle to be supported, and a conductive film prepared using the gold support particle and having excellent conductivity and transparency.
A gold support particle according to the present invention comprises: a support particle; and a gold particle supported on a surface of the support particle. Both of an average primary particle size and an average agglomerated particle size of the gold particle are 1 to 10 nm, a support amount of the gold particle is 1-50% by weight relative to the total weight of the gold support particle, and the support particle comprises an oxide particle.
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Inventors:
SAWAKI HIROKO
KAMINE TOMOKAZU
KAMINE TOMOKAZU
Application Number:
JP2010189432A
Publication Date:
March 08, 2012
Filing Date:
August 26, 2010
Export Citation:
Assignee:
HITACHI MAXELL
International Classes:
H01B5/00; H01B5/16; H01B13/00; B01J23/66; B01J35/02; H01M4/86; H01M4/90
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners