Title:
GRANULAR COMPOSITIONS ADDED TO RESIN MOLDINGS CONTAINING ATACTIC POLYMER
Document Type and Number:
Japanese Patent JPS5298042
Kind Code:
A
Inventors:
HISHIDA IWAO
Application Number:
JP1413276A
Publication Date:
August 17, 1977
Filing Date:
February 12, 1976
Export Citation:
Assignee:
HISHIDA IWAO
International Classes:
C08L23/00; C08J3/20; C08K5/09; C08K9/00; C08K9/04; C08L7/00; C08L21/00; C08L23/02; C08L23/10; C08L25/00; C08L25/06; C08L51/00; C08L51/02; C08L55/02; C08L101/00; (IPC1-7): C08J3/20; C08K5/09; C08K9/04; C08L23/02; C08L25/06; C08L55/02
Domestic Patent References:
| JP46026899A | ||||
| JPS4824016A | ||||
| JPS4924136A | 1974-03-04 |
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