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Title:
GRINDING APPARATUS
Document Type and Number:
Japanese Patent JP2014042950
Kind Code:
A
Abstract:

To provide a grinding apparatus which allows a footprint to be downsized.

A double wheel 35 is constructed by concentrically arranging a finishing grinding wheel 36 and a rough grinding wheel 37 having a larger diameter than the finishing grinding wheel 36. A diameter D1 of the finishing grinding wheel 36 is equal to or larger than a diameter d of a processed object 1, whereas a diameter D2 of the rough grinding wheel 37 is equal to or larger than the double of the diameter d of the processed object 1, and a difference between a radius R1 of the finishing grinding wheel 36 and a radius R2 of the rough grinding wheel is equal to or larger than a radius r of the processed object 1. The double wheel 35 is rotated and the processed object 1 is horizontally moved below the rough grinding wheel 37 to carry out rough grinding, and subsequently an outer periphery of the finishing grinding wheel 36 is positioned at a center of the processed object 1 having passed the rough grinding wheel 37, in order to carry out finishing grinding of the auto-rotating processed object 1 with the finishing grinding wheel 36.


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Inventors:
ASAI KOHEI
Application Number:
JP2012185586A
Publication Date:
March 13, 2014
Filing Date:
August 24, 2012
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24D7/02; H01L21/304
Domestic Patent References:
JPH0758068A1995-03-03
JPH09174398A1997-07-08
JPH0732252A1995-02-03
JPH0758068A1995-03-03
Foreign References:
US20090191793A12009-07-30
US20090191793A12009-07-30
Attorney, Agent or Firm:
Suenari Mikio