研削装置、及び研削方法 - 東京エレクトロン株式会社

Title:

研削装置、及び研削方法

Document Type and Number:

Japanese Patent JP7446084

Kind Code:

B2

Abstract:

To provide a technique that can suppress chips from being accumulated.SOLUTION: A grinding device comprises: a chuck that holds a substrate; a grinding unit which a grinding tool for grinding the substrate is attached; a housing in which a grinding chamber for housing the chuck and the grinding tool is formed; a first liquid supply part that supplies grinding liquid to a space between the substrate and the grinding tool, in the grinding chamber; and a second liquid supply part that supplies the grinding chamber with cleaning liquid containing substances different from the grinding liquid, which suppresses chips generated in grinding the substrate from being accumulated.SELECTED DRAWING: Figure 4

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Inventors:

Kazuya Ikegami
Tetsuo Fukuoka
Munehisa Kodama
Takashi Sakagami

Application Number:

JP2019201368A

Publication Date:

March 08, 2024

Filing Date:

November 06, 2019

Export Citation:

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Assignee:

東京エレクトロン株式会社

International Classes:

B24B55/03; B24B7/22; B24B55/06; H01L21/304

Domestic Patent References:

JP2019181584A
JP2006237333A
JP2003068677A
JP2006247760A
JP10303152A
JP2009519837A
JP2010124006A
JP2017177295A
JP2010149222A

Attorney, Agent or Firm:

Tadashige Ito
Tadahiko Ito

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