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Title:
GRINDING DEVICE FOR SUBSTRATE
Document Type and Number:
Japanese Patent JPH11277411
Kind Code:
A
Abstract:

To provide a grinding device for substrates capable of continuously supplying a very small amount of water or solution instead of droplets of water to the grinding surface of a grinding wheel.

In a grinding device for substrates, which grinds the surface to be ground of the substrate 4 flat and mirror-finished by sliding the grinding wheel 15 on the substrate 4, a nozzle 10 for supplying water or solution to the grinding surface of the grinding wheel 15 or the surface to be ground of the substrate, is provided. The tip position of the nozzle 10 is arranged close to the grinding surface of the grinding wheel to a degree that no liquid-drops cannot be formed between the tip of the nozzle 10 and the grinding surface of the grinding wheel 15 or the surface to be ground of the substrate 4.


Inventors:
HIROKAWA KAZUTO
HIYAMA HIROKUNI
WADA TAKETAKA
MATSUO NAONORI
Application Number:
JP9688398A
Publication Date:
October 12, 1999
Filing Date:
March 25, 1998
Export Citation:
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Assignee:
EBARA CORP
International Classes:
B24B37/00; (IPC1-7): B24B37/00
Attorney, Agent or Firm:
Isamu Watanabe (2 outside)



 
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