Title:
GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2022175737
Kind Code:
A
Abstract:
To reduce vibration of a grinding unit in a direction orthogonal to the rotation shaft of a spindle.SOLUTION: There is provided a grinding device comprising: a spindle; a grinding unit including a flange an upper surface side of which is fixed to a lower end of the spindle; a vibration measurement unit for measuring an amount of vibration of the grinding unit in a direction orthogonal to a rotation shaft of the spindle; and a control unit. Inside the flange or on the flange, a balance adjusting mechanism is provided, which has: three or more weights arranged around the rotation shaft; and a plurality of piezoelectric actuators each one of which is disposed outside each weight in a radial direction of the flange. Based on vibration data of the grinding unit measured using the vibration measurement unit, the control unit adjusts an amount of displacement of at least one piezoelectric actuator in the radial direction, thereby adjusting a weight brought into contact with the at least one piezoelectric actuator to adjust rotational balance of the grinding unit.SELECTED DRAWING: Figure 2
Inventors:
YAMANAKA SATOSHI
Application Number:
JP2021082394A
Publication Date:
November 25, 2022
Filing Date:
May 14, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B45/00; B24B7/04; B24B49/10; H01L21/304
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato