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Title:
研削装置
Document Type and Number:
Japanese Patent JP6734667
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To recognize a wear amount of a grinding tool and eliminate useless operations in grinding.SOLUTION: A grinding device 1 includes: a table 30; grinding means 7; means 5 which feeds the grinding means 7 for grinding; means 8 which dresses a grinding surface 740a of a grinding tool 740; and calculation means 9. The dressing means 8 includes: a table 81 for holding a dresser board 80; an AE sensor 82 which is arranged in the table 81 so as to detect contact between a board top face 800 and the grinding surface of the grinding tool; and means 83 for moving the table 81. The grinding feeding means 5 includes a grinding feeding position recognition section 55. The calculation means 9 subtracts a grinding feeding position where the grinding surface of the grinding tool which is fed for grinding after dressing and is detected by the sensor 82 is brought into contact with a reference surface 800a in which the board 80 is not ground by dressing from a grinding feeding position where the grinding surface of the grinding tool which is fed for grinding before dressing and is detected by the sensor 82 is brought into contact with the board top face 800 and calculates a wear amount of the grinding tool.SELECTED DRAWING: Figure 1

Inventors:
Akatsuki Qiu
Masashi Aoki
Application Number:
JP2016041985A
Publication Date:
August 05, 2020
Filing Date:
March 04, 2016
Export Citation:
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Assignee:
Disco Co., Ltd.
International Classes:
B24B47/25; B24B7/04; B24B49/10; B24B49/18; B24B53/00; B24B53/02; B24B53/12; H01L21/304
Domestic Patent References:
JP61175356U
JP2008302466A
JP2013031910A
JP2007175815A
JP2002018712A
JP63028563A
Foreign References:
US20140067321
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office



 
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