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Patent Searching and Data


Title:
研削装置
Document Type and Number:
Japanese Patent JP7171128
Kind Code:
B2
Abstract:
To provide a grinding device in which a grinding wheel can be easily attached to a wheel mount.SOLUTION: A grinding unit has a spindle and a wheel mount 34 comprising a first base whose upper surface side is fixed to a tip part of the spindle. To the wheel mount is attached a grinding wheel 36 comprising an annular second base whose upper surface side is attached to a lower surface side of the first base and a grinding stone 44 arranged on the lower surface side of the second base. The second base has an inner peripheral surface 40e defining an opening 40d penetrating from the upper surface through the lower surface of the second base. The wheel mount has a plurality of first chuck claws 62 fixed to the lower surface side of the first base to contact the inner peripheral surface of the second base and a second chuck claw 66 attached to the lower surface side of the first base to contact the inner peripheral surface of the second base. The second chuck claw is connected to a support member 72 fixed to a center side of the first base through an energizing member 74, and is supported to be movable in a radial direction of the first base by expansion and contraction of the energizing member.SELECTED DRAWING: Figure 4

Inventors:
Mitsuhiro Nomura
Takayuki Kabazawa
Akio Tsumagari
Application Number:
JP2018100243A
Publication Date:
November 15, 2022
Filing Date:
May 25, 2018
Export Citation:
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Assignee:
Disco Co., Ltd.
International Classes:
B24B45/00; B24B7/04; B24D7/06; H01L21/304
Domestic Patent References:
JP2016144842A
JP2017192998A
JP60183148U
JP52082991U
Foreign References:
US5447086
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara