Title:
研削盤及びそのプロービング装置の運用方法
Document Type and Number:
Japanese Patent JP7168469
Kind Code:
B2
Abstract:
To provide an operation method for a proving device which enables high speed and high accuracy measurement without occurrence of increase in a cost of the whole grinder.SOLUTION: There is provided a grinder in which an automatic balancing device is mounted on at least any rotary shaft including a grinding wheel spindle and a probing device is mounted for measurement on a machine, and the probing device comprises a mechanism for digital conversion of a signal level which is not a binary value but a multilevel numerical value. In this grinder, when measuring, the rotary shaft is rotated, and the automatic balancing device is caused to terminate balancing so as to be intentionally left vibration, or to terminate balancing in a large vibration state. During probing of the probing device, rotation of the rotary shaft is continued to superimpose the vibration component on output of the probing device, a signal after digital conversion is filtered with a lowpass filter or a bandpass filter, whereby quantization noise of desired signal frequency component is reduced.SELECTED DRAWING: Figure 5
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Inventors:
Takemi Asai
Application Number:
JP2019011763A
Publication Date:
November 09, 2022
Filing Date:
January 27, 2019
Export Citation:
Assignee:
Mitsui Seiki Co., Ltd.
International Classes:
B24B45/00; B23Q11/00; B23Q17/12; B24B49/10; G01M1/18
Domestic Patent References:
| JP2016175167A | ||||
| JP2018161716A | ||||
| JP2004181537A | ||||
| JP2001170863A | ||||
| JP8219927A |
Attorney, Agent or Firm:
Kurihara Kiyoshi