Title:
サファイア基板の研削方法
Document Type and Number:
Japanese Patent JP7271468
Kind Code:
B2
Abstract:
To provide a grinding method for a sapphire substrate capable of preventing pits from being generated on a surface.SOLUTION: A grinding method for a sapphire substrate includes the steps of: holding a sapphire substrate 101 with an r-plane defined as a principal surface on a chuck table 302; and grinding the principal surface of the sapphire substrate 101 held on the chuck table 302 with a grindstone 301. In the step of holding the sapphire substrate 101 on the chuck table 302, when a direction in which an angle forming an obtuse angle with an m-plane of the sapphire substrate 101 and being formed with the m-plane becomes maximum on the principal surface of the sapphire substrate 101 is defined as 0° and a clockwise direction is defined plus, the sapphire substrate 101 is held on the chuck table 302 in such a manner that a processing direction with the grindstone in a center of the principal surface of the sapphire substrate 101 becomes equal to or larger than -90° and becomes equal to or smaller than +90°.SELECTED DRAWING: Figure 6
Inventors:
Koji Kato
Hiroki Kano
Hiroki Kano
Application Number:
JP2020083034A
Publication Date:
May 11, 2023
Filing Date:
May 11, 2020
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H01L21/304; B24B1/00; B24B7/04
Domestic Patent References:
| JP5789551A | ||||
| JP201256009A | ||||
| JP2014159049A |
Foreign References:
| US20080166951 |
Attorney, Agent or Firm:
Masahiro Taguchi
Shigeo Torayama
Takashi Ito
Yasuyoshi Suzuki
Shigeo Torayama
Takashi Ito
Yasuyoshi Suzuki