Title:
GRINDING METHOD OF WORKPIECE
Document Type and Number:
Japanese Patent JP2023177697
Kind Code:
A
Abstract:
To provide a grinding method of a workpiece which can inhibit occurrence of chips at an outer periphery part of the workpiece.SOLUTION: A grinding method of a workpiece includes: a holding step 101 in which a workpiece is held on a holding table; a center part grinding step 102 in which a center part of the workpiece is ground to a predetermined thickness to form a recessed part with a first grinding wheel having an outer diameter smaller than that of the workpiece; and an outer periphery part grinding step 103 in which the first grinding wheel is relatively moved from the recessed part to an outer periphery area of a holding surface of the holding table to grind an outer periphery part of the workpiece surrounding the recessed part after the center part grinding step 102 is performed.SELECTED DRAWING: Figure 2
Inventors:
TABUCHI TOMOTAKA
Application Number:
JP2022090505A
Publication Date:
December 14, 2023
Filing Date:
June 02, 2022
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24B1/00; B24B41/06; H01L21/304
Attorney, Agent or Firm:
Sakai International Patent Office
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