Title:
溝付き研磨パッド及び方法
Document Type and Number:
Japanese Patent JP4820555
Kind Code:
B2
Abstract:
A polishing pad ( 104, 300, 400, 500 ) for polishing a wafer ( 112, 516 ), or other article. The polishing pad includes a polishing layer ( 108 ) having a polishing region ( 164, 320, 420, 504 ) defined by first and second boundaries (( 168, 172 ), ( 312, 316 ), ( 412, 416 ) ( 508, 512 )) having shapes and locations that are a function of the size of polished surface ( 116 ) of the article being polished and the type of polisher ( 100 ) used. The polishing region has several zones ((Z 1 -Z 3 ) (Z 1 '-Z 3 ')(Z 1 ''-Z 3 '')(Z 1 '''-Z 3 ''')) each containing corresponding grooves (( 148, 152, 156 )( 304, 308, 324 )( 404, 408, 424 )( 520, 524, 528 )) having orientations selected based on the direction of one or more velocity vectors (V 1 -V 4 )(V 1 '-V 4 ')(V 1 ''-V 4 '') (V'''-V 4 ''') of the wafer in that zone.
Inventors:
Gregory Pee Muldowny
Application Number:
JP2005022798A
Publication Date:
November 24, 2011
Filing Date:
January 31, 2005
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
International Classes:
B24B37/00; B24B37/04; B24D13/14; H01L21/304
Domestic Patent References:
| JP61297073A | ||||
| JP2000237950A | ||||
| JP2002217143A | ||||
| JP2001291687A | ||||
| JP2000094303A | ||||
| JP2003209077A | ||||
| JP62054666A | ||||
| JP52113496U |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Koshiro Tsukuda
Fumio Shinoda
Koshiro Tsukuda